Initial commercial focus: PCB prototyping
Exhibit 1: DragonFly 2020 3D printer
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Exhibit 2: Switch software package
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Exhibit 1: DragonFly 2020 3D printer
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Exhibit 2: Switch software package
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Nano Dimension has initially focused on solutions for PCB prototyping that give electronics designers a fast, secure alternative to outsourced prototype production. Its solutions combine technologies from three key disciplines: nanoparticle inks, 3D printing hardware and computer-aided design (CAD) software.
Nano Dimension’s solution for PCB prototyping
Nanotechnology inks – the key differentiator
The key enabler behind the DragonFly system is a suite of nanotechnology inks, which form both the conductive and the insulating regions of a PCB.
The conductive inks contain a dispersion of silver nanoparticles. The inks are formulated so that they are sufficiently conductive to produce track widths that are as narrow as those produced using conventional lithographic processes, and exhibit uniform conductivity and good adhesion so that the tracks do not wear off during use. (Management states that these are the highest conductivity inks currently available.) The proprietary dielectric ink, which forms the insulating regions in circuit boards, is a modified epoxy. It is formulated so it can be extruded through DragonFly’s fine print heads. Once deposited and cured, it has similar electrical, thermal and mechanical properties to the FR4 material typically used as a substrate in rigid circuit boards.
Nano Dimension’s ability to create exceptionally conductive inks depends on a process for extracting 10-100nm particles of pure silver from widely available silver compounds. Nano Dimension licenses this IP from the Hebrew University of Jerusalem on an exclusive basis. Under the terms of this licence, which will remain in effect until at least April 2029, Nano Dimension will be required to pay royalties of around 3% on sales of conductive ink. The process is protected by three patents. In addition, Nano Dimension has submitted its own patent applications for the dielectric ink and a next-generation, ultra-conductive ink.
3D printer – innovative DragonFly incorporating patented technology
Nano Dimension’s DragonFly printer makes multi-layered PCBs by printing the conductive and dielectric inks onto a sacrificial substrate. Importantly, the two inkjet print heads have hundreds of small nozzles that allow for exact picolitre deposition of nanotech inks, contributing to the ability to achieve fine dimension conductive traces. Each pass of the print head deposits a 2 micron layer of material at the exact locations specified by the CAD software. The inks are heated to remove surplus solvent and then cured using strong IR/UV (infra-red/ultra-violet) light sources prior to the deposition of the next layer. The maximum size of circuit that may currently be deposited is 200x200x3mm. This does not cover all PCB applications, although management intends future generations of DragonFly printers to be able to output larger dimension boards. A large, complex, 10-layer board will potentially take overnight to print. Nano Dimension has submitted several patent applications covering its own printing technology, although the printer itself is built out of standard components.
Software – proprietary ‘Switch’ package with patented algorithms
The company’s proprietary software package, ‘Switch’, processes the output from different brands of CAD software used by electronic designers. Switch converts this output, which describes the topology of each layer of the circuit, into instructions for controlling the movement of the DragonFly printer heads and deposition of the inks. The user interface enables designers to adjust numerous parameters including layer thickness, conductor width, layer order, punching and rotation options as well as the shape or object outline. Nano Dimension has submitted a patent application covering algorithms used in the software that result in substantial savings in inks and time. Nano Dimension completed the development of the initial version of the Switch software package in July 2016. In April 2017, the company announced that it was working with Zuken, one of the leading providers of 3D print software to make it simpler for engineers to port designs from Zuken’s CR-8000 Design Force software suite to Nano Dimension’s Switch package.
Conventional PCB prototyping
PCB structure – multi-layers required for complex circuits
PCBs are an overlooked but vital and near ubiquitous part of electronic devices. In the simplest form, a single-sided PCB, a design of conductive tracks, is created on a non-conductive board by using chemical etches to remove unwanted copper. Components are then attached on the surface of the board so that the conductive tracks connect them up. The substrate provides a mechanical support for both conductive tracks and components.
As tracks on a single-layer board cannot cross each other, more complex designs are typically double-sided, while for the most complex circuits a multi-layer PCB is required. This consists of multiple layers (up to 30) of chemically etched insulating substrates with conductive tracks on both sides. The substrate layers are sandwiched together with insulating material separating each layer. The connective tracks loop around each other, passing from layer to layer through regions referred to as vias.
Outsourced prototyping predominates
The majority of electronics manufacturers outsource PCB prototyping. During the design phase of a new electronics device, engineers define the topology of the PCB and simulate its performance using CAD software, then send that design information to a third party, which will manufacture a small number of PCBs using exactly the same process as that used for volume production. This is a highly specialist process requiring significant capital investment and manufacturing know-how. Photolithography is used to pattern the electrical traces on each layer of substrate, with around 15 different steps required to pattern each layer. Further processing steps drill the holes for the vias, copper plate them to make them conductive, align the individual layers so that the traces track correctly from one layer to another and press the layers together at high temperature.
Drawbacks of outsourcing – delays and IP leakage
Although outsourcing is much more capital efficient, it does add a delay to the process (anywhere between one day and three weeks depending on the location of the supplier, most of which are in the Far East) and urgency, especially when one takes into account that the design phase can involve several iterations. This delay can clearly be costly, but it can also result in suboptimal designs as the number of design iterations is often curtailed to reduce cost and the length of the design cycle. In certain verticals (eg defence, cutting-edge technology) there is also a potential IP risk inherent in outsourcing prototype production to a third party. We note that many of the beta-phase customers are engaged either in the defence industry or in Silicon Valley. In both sectors, security of IP is vital and the ability to carry out multiple design variants in the time previously taken to get a single circuit board manufactured is a significant competitive advantage.
Scoping potential for a disruptive technology – top-down approach
As using 3D printing techniques for PCB prototyping is a disruptive technology, there are no statistics relating directly to market size. In January 2016, industry commentator TechNavio noted that the global PCB market reached nearly US$61.5bn in 2015, and predicted an increase to US$63.5bn in 2016 with a CAGR of 3.1% from 2016 to 2021. In November 2016, Future Market Insights predicted that the global value of the PCB design software market would grow at a CAGR of 12.9% from around $1.4bn in 2016 to around $4.8bn by 2026. It noted that one of the key drivers for market growth is the requirement to simplify the PCB design process and thus accelerate the design phase for inventive electronic devices. This indicates that the level of PCB design activity globally continues to grow and, consequently, that demand for PCB prototyping is rising. If we assume that the PCB market continues to grow at a 3.1% CAGR between 2021 and 2025, it will reach US$83.6bn by 2025. Demand is being driven by the need to introduce new electronic products quickly, especially in the consumer electronics, medical devices and automotive sectors. Noting that global average expenditure on R&D is 2.4-5% of GDP, we assume that 5% of the global PCB market value is PCB prototyping. If 20% of this prototyping activity is brought in house, this represents a total available market of US$836m, equivalent to 8.6k PCB printer systems annually if the price erosion profile adopted in our valuation is used.
Nano Dimension could enlarge the market for prototyping equipment
As an alternative point of reference, the current market leader for dedicated PCB prototyping equipment (which is not based on 3D printing) is Germany-headquartered LPKF Laser & Electronics. In 2016, LPKF’s electronic development equipment division, which is predominantly PCB prototyping equipment, generated revenues of €22.6m (€25.5m in 2015). We estimate that this represents sales of several hundred prototyping units annually. Nano Dimension’s solution, once commercialised, will potentially be substantially easier to use than LPKF’s equipment, since it requires one rather than multiple steps, and is therefore likely to attract more users, in our view.
Estimated one million users of PCB design software globally
With regard to the total number of potential sales annually, Nano Dimension estimates that there are around one million users of PCB design software globally, all of whom need access to PCB prototyping services. It also cites around 1,800 PCB-related service providers and around 500 academic departments engaged in electronics design in the US alone. While smaller teams of designers will probably continue to outsource prototyping to third parties, larger teams spending US$100k or more per annum on prototyping constitute a key target segment for Nano Dimension. For these teams, purchasing a DragonFly system for c US$200k gives a short payback period. Another key target segment is companies offering prototype services. Many of these prototyping bureaux located in North America, Europe and Israel may have had their own processing equipment historically, but now act only as intermediaries between designers and print shops in the Far East. We note that a significant proportion of the companies participating in the beta-phase programme (see below) were either involved in defence and other sectors where protection of IP is critical, or were PCB design bureaux.
Scoping potential – bottom-up approach
Exhibit 3: Summary of Nano Dimension’s survey results
Respondents who: |
Amount spent annually on prototyping |
Use external prototyping services |
91% |
US$100k+ |
16% |
Require multi-layer circuits |
66% |
US$50-100k |
14% |
Are concerned about IP security |
<67% |
US$10-50k |
37% |
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<US$10k |
33% |
Source: Nano Dimension data, October 2016.
Nano Dimension has already received over 7,000 enquiries for the DragonFly. Around 1,000 of these contacts, gathered from 31 industries and disciplines and 25 countries, participated in a survey, giving some indication not of the total available market but of likely actual interest in DragonFly in the medium term. This is helpful for assessing potential uptake given that the market does not exist yet, so there are no data regarding its size. Nano Dimension is focusing initially on those businesses spending US$100k or more annually on prototyping services, as these will benefit from the shortest payback time (around two years). If we assume that the survey is a representative sample of PCB designers, then an estimated 160,000 of the million designers globally will be in teams that spend more than US$100k each year on prototyping. If we assume that these engineers are based in teams with an average of 12 engineers each, this represents a market opportunity of 13.3k PCB prototyping systems. Adding the 1,800 US-based service providers and 500 academic establishments noted above gives a total available market of 15.6k PCB printing systems. This estimate excludes service providers and academic establishments outside the US.
Our analysis of the competitive environment indicates that there are currently only two other companies that offer 3D printers intended for PCB prototyping. These two, BotFactory and Voltera, are not able to manufacture multi-layer boards because they do not have the ability to print the insulating material that separates the conductive traces in different layers. Also, since neither BotFactory nor Voltera uses inks with as high a level of conductivity, they cannot produce circuits with very fine traces. As neither can be used to manufacture complex boards, they command a lower price point than the DragonFly, which is the first 3D printing system to reach IPC (formerly Institute of Printed Circuits, now Association Connecting Electronics Industries) standards for PCBs. Nano Dimension is thus able to target a more sophisticated user base.
The other 3D printers listed in Exhibit 4 are intended for structural electronics applications (see below), not PCB prototyping, and lay down multiple layers of filaments, not inks. Even if these printers are combined with software for converting PCB designs to 3D print instruction and a conductive filament for depositing electrical tracks, the relatively poor conductivity of the filament means that the minimum trace width is, in our opinion, insufficiently fine for the finished board to be of use to anyone other than hobbyists. The use of specially formulated conductive inks distinguishes the DragonFly from conventional 3D printers that have been adapted to use conductive pastes. These can only produce single-layer circuits with fairly thick traces, which appear to be only suitable for hobbyists. None of the printers listed appears to be shipping in volumes exceeding several dozen annually.
Exhibit 4: Competitive prototyping equipment
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Number of layers |
Minimum line width |
Cost |
Availability |
Comments |
Nano Dimension DragonFly 2020 |
<17 PCB |
90 micron |
$150k** |
Now |
Two inks – one conductive, one insulating |
BotFactory Squink |
Two*-layer PCB |
254 micron |
$5k |
Now |
Patterns solder paste and places components |
MGI Group CeraPrinter |
3D object with embedded wiring |
150 micron |
$400k |
Now |
Some equipment incorporates Optomec technology |
Mutracx Lunaris |
Inner layers only |
100 micron |
Unknown |
Now |
Volume PCB manufacture |
Optomec Aerosol Jet |
3D object with embedded wiring |
N/A |
Unknown |
Now |
Also 3D printing of metals and biological material |
Voltera V-One |
Double-sided PCB |
200 micron |
$3k |
Now |
Patterns solder paste and heats for reflow stage for surface mount components |
Voxel8 |
3D object with embedded wiring |
250 micron |
$9-17k |
Now |
Also 3D printing of medical products, athletic textiles and footwear |
Xerox |
3D object with embedded wiring |
N/A |
N/A |
Under development |
Using conductive filaments to create traces |
LPKF mechanical milling |
<Eight-layer PCB |
100 micron |
$6-17k |
Since 1990s |
Additional steps needed for multi-layer boards |
LPKF laser milling |
<Eight-layer PCB |
50 micron |
$100k |
Now |
Additional steps needed for multi-layer boards |
LPKF laser transfer printing |
Individual layers |
Unknown |
Unknown |
Now |
Currently being sold for antenna production but could be used for printing individual PCB layers |
Source: Edison Investment Research, information from company websites. Note: *users encouraged to experiment with more than two layers. **Average selling price to end-user.
In-house prototyping using PCB milling techniques
Until the application of 3D print technology to PCB prototyping, design teams wanting to manufacture prototypes in house would use dedicated milling equipment to process individual layers forming a PCB. Older technology (LPKF, MITS, T-Tech) uses mechanical cutting tools to scrape away the unwanted copper from each layer. Newer technology (LPKF) uses lasers to remove the unwanted copper. Laser-based equipment gives a higher resolution but is much more expensive. Importantly, additional equipment is needed to plate the vias, cut the circuit to size, and to align and press the individual layers to make a multi-layer circuit. This adds complexity to the prototyping process. Some of these steps involve dangerous chemicals and are not appropriate for a design environment.
The advantages of Nano Dimension’s system compared with PCB milling are:
■
Electrical contact is made when a conductive trace from a lower layer meets a trace on the layer above, so there is no need to drill holes and plate through them to create vias. This eliminates the use of hazardous chemicals used in through plating, which are out of place in a design environment.
■
The layers are built up in a single process so there is no need to align them and press them together to create a complete multi-layered board.
■
The inks are deposited as a circuit of the correct size and shape, so there is no need to cut unusually shaped circuits out of a rectangular substrate.
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PCBs with fine traces may be manufactured without needing to locate bulky equipment in a clean-room environment.
On the cusp of commercialisation
The previous 12 months have been an exciting time for Nano Dimension as it has passed successive milestones en route to commercialisation in line with management’s stated schedules. It has proved that the technology can work in a customer environment and is able to accelerate PCB turnaround times and enhance IP security. The next few months are critical, as this is when the company will commence commercial shipments, thus confirming it is able to deliver on our estimates and, importantly, validating the company’s pricing strategy and business model.
Exhibit 5: Key milestones to commercialisation
Delivery of first printer to customer for onsite beta test |
Delivered August 2016 |
Delivery of printers to beta-test customers in Silicon Valley |
Delivered Q416 |
Financing to fund expansion of ink production |
Completed September 2016 |
Receipt of first revenues from beta-test customers |
Q416 |
Delivery of final printer for beta-phase testing |
June 2017 |
Completion of expansion of ink production |
H217 |
Deliveries of commercial version of DragonFly and receipt of associated revenues |
H217 |
Source: Edison Investment Research
Scaling up production
In-house ink production facility constructed
The inks are currently manufactured in house. So far, Nano Dimension has not needed large volumes of ink, but this will change once the company starts to deliver printers for commercial use later in 2017. Since the formulation of the inks is a key differentiator, Nano Dimension is investing US$1.5m, most of which capital expenditure will occur in FY17, in expanding its ink production capability ahead of the commercial launch. The construction phase of the project is finished and management expect the permitting phase to be completed within a few weeks. The production equipment required for the early commercialisation phase is already in place elsewhere in the building, so management is confident that everything will be in place to support ink production for the onset of commercial deliveries.
Flex set up to provide outsourced manufacturing of printer
In January 2016, Nano Dimension announced that it had an agreement with Flex to manufacture the DragonFly. This means that there is no limitation on production volumes or risk in scaling up to commercial volumes. Flex’s staff have already been trained so that they are poised to commence production when required. (This scaling-up process does involve significant risk. We note the possibly terminal challenges faced by a potential rival, the start-up Cartesian Co, which attempted to build printers in house and experienced severe problems with suppliers.)
Distribution and sales network in place
Nano Dimension is addressing the market through a combination of direct sales and distribution agreements. In March 2016, it signed an agreement to collaborate with FATHOM to distribute the DragonFly in Silicon Valley and the greater West Coast area. FATHOM (70+ employees) is an advanced manufacturer, distributor and service provider with expertise in 3D printing. In September 2016, FATHOM became the first beta phase site in the US. So far in 2017, it has announced collaborations with distributors in the UK and Ireland, Canada and Australia. During H217, it intends to establish a sales office in the US West Coast San Francisco Bay area. This will become the main sales office as the US is a key market. Six of the 16 beta-phase customers are US-based.
Beta-phase completed successfully
A beta version of the 3D printer was shown at the Printed Electronics USA trade show in November 2015 and at CES in January 2016. Then, between August 2016 and June 2017, Nano Dimension delivered 16 printers to customers participating in the beta-phase test programme. As well as the US distribution partner mentioned above, participants in the programme include: four companies involved in the defence sector; a US-based Fortune 100 multinational in the technology sector; one of the 10 largest bank holding companies in the US, which has installed the printer in its hardware development centre; a medical device company; a smart transportation company; and a solar energy company, all of which are very keen to protect their IP. Other participants include one of the 10 largest PCB manufacturers globally, one of the top 10 contract manufacturers globally and three PCB design bureaux in Israel, all of which are interested in the fast turnaround times that the technology offers. The majority of these customers have been paying to lease the printers during the beta phase, providing a useful source of income. They have also provided valuable feedback to direct further product development, which has enabled Nano Dimension to upgrade and refine the technology, printing capabilities and work processes of the DragonFly printer. In July, management noted that it had sufficient beta-phase partners and intended to move to early commercial sales of printers and related proprietary inks during H217.
The feedback so far has been mainly positive. Customers have been using the printers extensively, in some cases manufacturing five or six PCBs each week with the equipment. The customers have successfully made PCBs with up to 12 layers. The beta testing uncovered some minor problems, mainly software functionality, which have been fixed. The resolution of teething problems is to be expected during a beta test phase and highlights why Nano Dimension was keen to have an extended beta test phase with customers that would provide detailed feedback. Nano Dimension notes that the current generation of the DragonFly has been shown to be suitable for the early adopters who will receive the first commercial shipments of the printer. It will continue to make successive modifications to the DragonFly printer and ink formulations so that the system is suitable for wider deployment.
Future developments: Moving beyond prototyping
Although Nano Dimension is highly focused on moving to the commercial phase of the PCB printer and software, it has made significant progress in developing 3D print systems for other sectors and the next-generation 3D print system for PCBs. Importantly, it is protecting this IP through patent applications. Since it is unlikely that significant R&D effort will be dedicated to launching an alpha-stage demonstration of technology for any of these complementary applications until the DragonFly is shipping in volume, any potential revenues derived from these applications are treated as upside to our estimates and valuation.
3D printing for space applications
In February 2017, Nano Dimension announced that it had received a budget from the Israel Innovation Authority to finance a project to develop 3D printing of advanced ceramic materials. This project is primarily intended to find a better way of manufacturing aerospace and automotive components. In addition, it potentially gives a route for replacing the insulating material in PCBs with ceramic, thus improving the substrate’s mechanical and thermal characteristics. This was followed in June 2017 by an announcement regarding another grant from the same body to develop 3D ceramic materials that can be used to print low-density, high-thickness components for space applications. This project will use novel ceramic material precursors from Semplastics, which has been used in prototype space applications for NASA. In June 2017, Nano Dimension announced that it was working with Harris Corporation to develop 3D printing of multi-layer PCBs for space applications. These would be able to distribute digital, power and RF signal on the same substrate, thus reducing the size, weight, power and cost of electronic modules. This project is a step on the road to creating structural electronics for space applications. Both these projects are partly supported by grants from the Israeli Innovation Authority.
3D bio-printing
In May 2016, Nano Dimension successfully lab-tested a proof-of-concept 3D bio-printer for stem cells using an adapted 3D printer. The trial was conducted in collaboration with Accellta, which provided the suspensions of stem cells. The combination of Accellta’s ability to produce billions of high-quality stem cells per batch and Nano Dimension’s high-precision, high-throughput 3D printing expertise opens the possibility of printing complex biomaterials for use in preclinical drug discovery and testing, cosmetics safety testing, toxicology assays, tissue printing and 'organs on chips'. This is already an active market. For example, Organovo is already producing liver models for pharmaceutical testing and is partnering with L’Oréal to produce 3D-printed skin for cosmetics safety testing, while Cellink has a commercial bio-printer and a distribution agreement with Thermo Fisher Scientific. Nano Dimension’s adapted printer could potentially make large volumes of tissues and organs more quickly than using other techniques. In June 2016, the company filed a patent in the US covering the conversion of images of organs from MRI and CT scans into a 3D representation of the biological structure of the tissue and organ, which is then converted into very thin 2D slices for 3D printing. Nano Dimension has stated that it will form a new entity to address this promising application and raise funds separately for it. This will focus initially on creating materials with similar functionality to kidney tissue.
Nano Dimension’s management has a combination of entrepreneurial acumen and experience of 3D technology. Co-founder and CEO Amit Dror is a serial entrepreneur with a background in project, account and sales management across a range of sectors. Co-founder and chief business officer Simon Fried has a background in marketing and sales strategy, management, business development and fund-raising. Co-founder and chief technology officer Sharon Fima is a print technology development expert whose experience encompasses inkjet technology, 3D printer production and nano-silver ink development. Previous positions include advanced research and development management at HP Indigo and XJet.
Chairman Itschak Shrem has more than 40 years of experience in financial markets and venture capital. Non-executive Director Ofir Baharav has held several senior roles at companies in the 3D printing industry, including VP of product portfolio for Stratasys and CEO of XJet. Non-executive director Avi Reichtental, who joined the board in April 2017, was previously president and CEO of 3D print major 3D Systems.
The beta testing programme has completed, demonstrating that the current generation of the DragonFly is suitable for the early adopters who will receive the first commercial shipments of the printer. This reduces the technological risk substantially. However, Nano Dimension needs to make further adjustment to the DragonFly printer and ink formulations so that the system is suitable for wider deployment, which still represents material risk. For example, it needs to prove that the technology can provide prototypes of equivalent performance to those manufactured using photolithographic techniques, particularly with regard to compatibility with assembly techniques or lifetime reliability.
There is no guarantee that the new ink manufacturing facility will be able to produce inks economically in volume, although the risk has been reduced by scaling up the production processes as far as is feasible within a laboratory environment.
As Nano Dimension offers a disruptive technology, there are by definition limited data regarding potential market size, so there is significant risk surrounding our assessment of market demand.
As the beta-phase activity only concluded in July, management has only recently focused attention on negotiating commercial sales contracts with potential customers. Quite rightly, in our view, up to this point the focus had been on supporting the technical aspects of the beta phase. This shift has given management greater awareness of the length of sales cycles when dealing with the large corporates that form its initial target market, indicated an appetite for leasing rather than purchasing equipment, and confirmed initial views of pricing. However, there is no certainty that either the proportion of customers leasing equipment assumed in our financial model and indicative valuation or the rate of pipeline conversion will be appropriate. We note the potential impact of widespread adoption of leasing on cash flow.